Universiteit TwenteEnschede · Posted 14 Sept
PostDoc position on Wafer Bonding Physics for 3D Chip Integration
Employer can sponsorPosting in English
Job details
- Location
- Enschede
- Salary
- Not stated
- Experience
- Not stated
- Language
- English
- Job type
- Not stated
- Relocation
- Not mentioned
Source: Universiteit Twente, direct from their site.
About the role
Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently u…
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